Permanently Conductive RoHS Compliant Waffle Pack Chip Trays For Long Term Storage
In the semiconductor industry, the long-term reliability of a component is often dictated by the stability of its packaging material. This series of Permanently Conductive Waffle Pack Chip Trays is engineered with a focus on material science to provide a safe and stable environment for sensitive microelectronics.
Unlike standard plastic trays that may lose their antistatic properties over time, our waffle packs are molded from carbon-fiber reinforced polymers or specialized conductive ABS/PC resins. This ensures that the electrostatic discharge (ESD) protection is an inherent part of the material structure, not just a surface treatment. The result is a tray that meets both ESD and RoHS environmental standards permanently. These traditional "waffle" format trays, typically 2 or 4 inches square, feature a regular pattern of separator ribs that create secure pockets for bare die, chip-scale packages (CSP), and flat 2.5D components.
Key Features/ Benefits
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Permanent ESD Protection
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Exceptional Dimensional Stability
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RoHS and Environmental Compliance
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Cleanroom Ready (Class 100-1000)
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High Precision Flatness
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Versatile Sizing and Material Grades
Specifications
| Brand |
Hiner-pack |
| Model |
HN24092 |
| Material |
ABS |
| Tray Type |
2-inch Waffle Pack |
| Color |
Black |
| Resistance |
1.0×10⁴ - 1.0×10¹¹ Ω |
| Outline Line Size |
50.7x50.7x4mm |
| Cavity Size |
2.03x2.03x0.38mm |
| Matrix QTY |
16X16=250PCS |
| Warpage |
MAX 0.2mm |
| Service |
Accept OEM, ODM |
| Certifications |
RoHS, ISO |
Applications
These custom-engineered waffle packs are the ideal solution for non-standard microelectronic assembly and specialized component handling. Their primary applications include: Prototype Assembly of New Sensors, where the pocket must match a unique physical profile; Handling of Fragile Medical Micro-Parts, such as surgical implants or diagnostic sensors; and Secure Transport of Specialized Gems or Watch Components, where high-value items require individual, anti-crush compartments. They are also widely utilized in Engineering Lines transitioning to Automation, providing a consistent interface for custom tools. Because they adhere to the unofficial industry-standard 2-inch or 4-inch footprint, they remain compatible with existing waffle pack accessories like covers and clips while offering a completely bespoke internal environment.
Customization
We provide a comprehensive "design-from-scratch" service to meet your most challenging packaging needs. Customization options extend to Component Support Features, such as pedestals that lift the part to protect bottom-side features, or Reference Marks and Fiducials molded directly into the tray to aid machine vision systems. You can specify the Material Type (Conductive ABS, PC, or high-temp resins), Color-Coding for lot identification, and even Engraving for part numbers. Whether your part requires terminal isolation or specialized pad protection, our team can optimize the pocket geometry to ensure 100% alignment. For low-volume needs, we also offer CNC machining or 3D printing options, though molded trays remain the gold standard for high-precision, ESD-safe mass production.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Factory-direct manufacturer of JEDEC & IC trays
- JEDEC compliant, automation-compatible designs
- OEM & ODM customization supported
- Consistent quality and stable supply
- Trusted by global semiconductor customers
